EPOXY RESIN BLACK POTTING COMPOUND 4 CIRCUIT BOARD & ELECTRONIC MASKING SEALANT

Description

MAX MCR A/B
Black Potting Compound
Encapsulating Resin
For Electronic Circuit Boards
96-ounces Combined Volume
1/2 Gallon Of Resin
And
1 Quart Of Curing Agent
RoHS & REACH Conflict Minerals Compliant
Electrical Insulating And Potting Of Electronic Circuitry
Permanent Opaque Black Masking Compound For Proprietary Electronics
Electrical Potting Compound
Embedding Or Masking Compound
Waterproof Low To High Voltage Circuit
Electrical Insulating And Potting Of Electronic Circuitry
Permanent Opaque Black Masking Compound For Proprietary Electronics
Circuit Board Conformal Coating
Electrical Potting Compound
Waterproof For Continuous Salt Or Fresh Water Immersion
Low To High Voltage- AC/DC Circuit
PRODUCT DESCRIPTION
MAX MCR BLACK A/B is an unfilled medium working time, low viscosity potting compound resin system for embedding or encapsulating printed circuit boards (PCB), relays, coils, and other electronic or electrical circuitry.
MAX MCR A/B is low in viscosity and is room temperature cured. It is mixed 2:1 by weight or by volume and provides a 30 minute working time (200-gram mass) Upon cure, MAX MCR is completely non electrically conductive offers a very high gloss finish blemish free surface.
It cures to a hard but tough compound that is suitable for small to medium parts (up to 200 grams/6 fluid ounces).
The 2 to 1 mix ratio offers ease of use and easily poured in place or can be adapted for mix meter equipment.
MAX MCR A/B bonds to PVC, PP, ABS, aluminum, steel, copper, brass and other materials typically used in electrical circuits.
MAX MCR A/B can also be utilized in many different applications where epoxy resins are typically employed.
It bonds very well to wood, metal, concrete and other composite and plastic substrates.
MAX MCR PHYSICAL PROPERTIES
AND
CURED MECHANICAL PROPERTIES
F
orm And Color
Black Liquid, Self Leveling Other Colors Available
Viscosity Part A
2,500 cPs
@75°F
Viscosity Part B
750 cPs
@75°F
Mixed Viscosity
1,950 cPs
@75°F
Mix Ratio By Weight
(2:1) 100 Parts A to 50 Parts B
Mix Ratio By Volume
(2:1)100 Parts A to 50 Parts B
Mixed Density
1.10 g/cc
Working Time
30 minutes (200-gram mass)
Gel Time
60 minutes
@75°F
Peak Exotherm
280°F max (400-grams)
Demold Time
24 hours room temperature
@75°F
Accelerated Cure
2 Hours @75°F
+30 minutes @200°F
Shore Hardness
75 Shore D
Shrinkage:
<0.30 %
Compressive Strength
13,800 psi
@75°F
Tensile Strength
9,900 psi
@75°F
Tensile Elongation
4%
@75°F
Heat Distortion Temperature
190°F
ELECTRICAL AND THERMAL CONDUCTIVITY PROPERTIES
Volume Resistivity
4.7 X 10
13
Ohms-Cm
Dielectric Strength
510 Volts/Mil 60 Cycles
Dielectric Constant
4.0 (10 kHz)
Dissipation Factor
0.014 (10 kHz)
Thermal Conductivity (Unfilled) 40°-45°C
0.25 W F/mK
CHEMICAL RESISTANCE PERFORMANCE
FULL IMMERSION AT 25°C
MEASURED PERCENT CHANGE IN WEIGHT
Reagent
10 days
28 Days
Deionized Water
0.03 %
0.03 %
Sea Water
0.01 %
0.08 %
Methanol
0.93 %
2.41 %
Ethanol
1.98 %
1.28 %
Toluene
0.40 %
2.86 %
Xylene
0.04 %
0.05 %
Gasoline (E85 Blend)
0.10 %
0.23 %
Dimethyl Formamide
Destroyed
Destroyed
10% Lactic Acid
0.81 %
1.42 %
10% Acetic Acid
0.11 %
0.45 %
70% Sulfuric Acid
0.08 %
0.14 %
50% Sodium Hydroxide
0 %
0.1 0%
10% Sodium Hypochlorite
0.51 %
0.96 %
MAX MCR A/B Available Kit Sizes
48-Fluid Ounce Combined Volume:
https://www.ebay.com/itm/223885745256
96-Fluid Ounce Combined Volume:
https://www.ebay.com/itm/311946513165
192-Fluid Ounce Combined Volume:
https://www.ebay.com/itm/311960933510
High-pressure Sensors Potted With
MAX MCR A/B
24 Volt Solenoid Valve Potted With MAX MCR A/B
Tested To >2,000,000 Cyclic On/off Test With No Failure
.
Direct Cast (No Box Enclosure) LED Driver Circuit Board Potting Using Silicone Mold
Circuit Board Potting With MAX MCR A/B
Waterproofing Of An Electrical Circuitry
Click The Picture To View The Video
MAX MCR A/B POTTING AND ENCAPSULATIO
N
MAX MCR A/B used as the black PCB potting compound. The clear resin used as the LED encapsulant is our MAX DIAMOND CLEAR, a cycloaliphatic epoxy resin that is resistant to damage and yellowing from the UV energy produced by the LED light.
It
demonstrates excellent transparency and color stability suitable for LED encapsulation.
MAX DIAMOND CLEAR A/B 48 OUNCE KIT
CRYSTAL CLEAR LED BULB ENCAPSULANT
Continuous Salt Water Immersion LED Dock Marker Lights
EPOXY RESIN MIXING AND USAGE APPLICATIONS
RESIN CRYSTALLIZATION FROM PROLONGED STORAGE OR COLD WEATHER EXPOSURE
The resin component or PART A may crystallize due to cold temperature exposure, especially after prolonged storage. Before using inspect the resin component for any solidified crystals which will as solid solid mass or grainy solids that collects at bottom of the PART A bottle.
View the following video for heat processing the bottle before use.
Do Not Use Unless Processed To Revert Any Crystallized Resin Back To A Liquid State And Avoid Poor Cured Results.
The use of a weighing scale is highly recommended for proportioning the 2:1 mix ratio. Using volumetric measuring is fine, however, weighing the resin and curing agent yields better-cured mechanical properties, batch repeatability, and less waste from mixing over-sized batch. Use this digital scale to precisely weigh the resin and curing agent and ensure full polymerization of the resin and curing agent and prevent leaching.
Purchase this scale with any of product offering and the shipping cost of the scale is free.
Please request a total before paying for combined shipping savings.
https://www.ebay.com/itm/222630300203
EPOXY RESIN MIXING AND THICK CASTING TROUBLE-FREE TECHNIQUE MAX MCR A/B RESIN SYSTEM - YouTube
Video will open in a new window
Please View The Following Video For The Proper Mixing Of Epoxy Resins. It Demonstrates The Proper Technique Of Mixing Any Type Of Epoxy Resin. The Proper Cure And Final Performance Of Any Epoxy Resin System Is Highly Dependent On The Quality And Thoroughness Of The Mix. The Resin And Curing Agent Must Be Mixed To Homogeneous Consistency.
EVIDENCE OF POOR MIXING
Video will open in a new window
The proper cure and final performance of an epoxy resin system are highly dependent on the quality and thoroughness of the mixing quality. The resin and curing agent must be mixed to homogeneous consistency to achieve proper cure and tack-free results.
MIXING TECHNIQUE
How To Mix Epoxy Resin For Food Contact Coating. Avoid Tacky Spots, Minimize Air Bubble When Mixing - YouTube
Video will open in a new window
Using the eBay App? Paste link into a browser window:
[isdntekvideo]
DON'T FORGET OUR EPOXY MIXING KIT
Click The Link To Add To Order
https://www.ebay.com/itm/222623932456
EVERYTHING YOU NEED TO MEASURE, MIX, DISPENSE OR APPLY
Proportioning the correct amount is equally as important to attain the intended cured properties of the resin system.
T
he container in which the epoxy and curing agent is mixed is an important consideration when mixing an epoxy resin system.
The container must withstand the tenacity of the chemical and must be free of contamination.
Most epoxy curing agent has a degree of corrosivity, as a general practice, protective gloves should be worn when handling chemicals of the same nature.
MIXING KIT CONTENTS
1 Each Digital Scale -Durable, Accurate Up To 2000.0 Grams
4 Each 32-ounce (1 Quart) Clear HDPE Plastic Mix Cups
4 Each 16-ounce (1 Pint) Clear HDPE Plastic Mix Cups
One Size Fits All Powder-Free Latex Gloves
2 Each Graduated Syringes
Wooden Stir Sticks
Brush
PLEASE CHECK OUT OTHER AVAILABLE
RESIN SYSTEMS AT OUR eBay STORE
For our complete listing, please
Visit our eBay store!
IMPORTANT NOTICE
Your purchase constitutes the acceptance of this disclaimer. Please review before purchasing this product.
The user should thoroughly test any proposed use of this product and independently conclude the satisfactory performance in the application. Likewise, if the manner in which this product is used requires government approval or clearance, the user must obtain said approval.
The information contained herein is based on data believed to be accurate at the time of publication. Data and parameters cited have been obtained through published information, PolymerProducts and  Polymer Composites Inc. laboratories using materials under controlled conditions. Data of this type should not be used for a specification for fabrication and design. It is the user's responsibility to determine this Composites fitness for use.
There is no warranty of merchantability for fitness of use, nor any other express implied warranty. The user's exclusive remedy and the manufacturer's liability are limited to refund of the purchase price or replacement of the product within the agreed warranty period. PolymerProducts and its direct representative will not be liable for incidental or consequential damages of any kind. Determination of the suitability of any kind of information or product for the use contemplated by the user, the manner of that use and whether there is any infringement of patents is the sole liability of the user.